New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader

Description

## Role Overview Intel India has invited verified applications for the position of New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader in US, New Mexico, Albuquerque. This full-time role is focused on vlsi digital. The offering scale is ₹18L - ₹45L+ Per Annum. Candidates with B.Tech / B.E., M.Tech / M.E., Ph.D. are eligible to submit direct applications before the closing deadline on Rolling. --- ### Key Responsibilities - **Execute cutting-edge engineering and verification workflows for New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader.**: Execute cutting-edge engineering and verification workflows for New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader. - **Collaborate with cross-functional semiconductor and systems architecture teams.**: Collaborate with cross-functional semiconductor and systems architecture teams. - **Uphold industry-standard EDA flows, timing closure, and tapeout readiness.**: Uphold industry-standard EDA flows, timing closure, and tapeout readiness. --- ### Technical Toolstack & Competencies #### Verification Methodologies - `UVM` • - `SystemVerilog` • - `SVA (SystemVerilog Assertions)` #### Simulation & Debug - `Synopsys VCS` • - `Cadence Xcelium` • - `Synopsys Verdi` #### Bus Protocols & Interfaces - `AMBA (AXI/AHB/APB)` --- ### Eligibility & Academic Criteria | Parameter | Requirement | | :--- | :--- | | **Target Qualifications** | B.Tech / B.E., M.Tech / M.E., Ph.D. | | **GATE / NET Requirement** | Desirable / Not Mandatory | | **Minimum Percentage** | 60% or 6.5 CGPA (First Class) | | **Experience Level** | Senior (5+ yrs) | | **Age Limit** | 28 years (Relaxations: OBC 3 yrs, SC/ST 5 yrs) | --- ### Compensation, Stipend & Tenure - **Scale / Offering**: **₹18L - ₹45L+** (Per Annum) - **Application Deadline**: **Rolling** --- ### Selection Process & Interview Stages 1. Technical Resume Screening 2. Domain Technical Evaluation 3. Architecture Interview & Final Offer --- ### Verified Direct Application [Apply on Official Intel India Portal](https://intel.wd1.myworkdayjobs.com/en-US/External/job/US-New-Mexico-Albuquerque/New-Mexico-Wafer-Packaging-Manufacturing-Advanced-Packaging-Die-Pick-Engineering-Group-Leader_JR0288867) > **Platform Guarantee**: Verified Opportunity: BerojgarDegreeWala links strictly to official government circulars and verified employer ATS portals. No third-party middlemen or application fees.