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SemiWiki28 October 2026

The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up

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Most of the AI conversation stops at the chip. At SEMICON West 2026 I sat down with René Jonker, Chief Product Officer of Soitec, to talk about what sits underneath it. Ask an engineer where AI performance comes from and you will hear about process nodes, dataflow, HBM stacks and interconnect fabrics. Rarely about the wafer. Yet a … Read More The post The Wafer Is the New Battleground: Soitec CPO

Topics:semiconductorEDAIPFoundryMaterialsSemiconductor