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SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape
EE Times23 September 2026

SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape

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EE Times

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Executive Briefing & Key Highlights

India moves five chip packaging plants into production as $13.5 billion ISM 2.0 expands manufacturing, design, and engineering capabilities. The post SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape appeared first on EE Times.

Topics:electronicssemiconductorindustryIndiaSemiconductor