Chip Industry Technical Paper Roundup: Oct. 6

Executive Briefing & Key Highlights

Low-contact-resistance WSe₂ transistors; backside clock meshes for 2nm GAAFETs; row-parallel processing in DRAM; HBF for high-throughput LLM serving; formal security analysis of CAN XL; abstraction and validation from physical devices to RTL. The post Chip Industry Technical Paper Roundup: Oct. 6 appeared first on Semiconductor Engineering.