Beyond the Die: Verifying the Connected Chip

Executive Briefing & Key Highlights

One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More The post Beyond the Die: Verifying the Connected Chip appea