Beyond Moore: Co-Optimizing AI from Systems to Materials

Executive Briefing & Key Highlights

At the OCP APAC Summit in Taiwan, August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message was more consequential than… Read More The post Beyond Moore: Co-Optimizing AI from Systems to Materials