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Electronics Weekly25 September 2026

Advanced packaging to be a $51bn market by 2031

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Electronics Weekly

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AI accelerators , HBM Integration, and Co-packaged optics are pushing higher performance packaging past  $51 billion by 2031, says Yole. High-end performance packaging revenue has a 27% CAGR during 2025-2031. […] The post Advanced packaging to be a $51bn market by 2031 appeared first on Electronics Weekly.

Topics:electronicscomponentsUKAdvanced PackagingMarketsSemiconductor