
Semiconductor Engineering24 September 2026
A Network-on-Chip (NoC) For Multi-Die Devices
Original Publication
Semiconductor Engineering
Executive Briefing & Key Highlights
Transporting the native packetized traffic of the NoC directly across die boundaries using a stable, invariant interface. The post A Network-on-Chip (NoC) For Multi-Die Devices appeared first on Semiconductor Engineering.
Topics:semiconductorchip designEDASemiconductor
