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A Network-on-Chip (NoC) For Multi-Die Devices
Semiconductor Engineering24 September 2026

A Network-on-Chip (NoC) For Multi-Die Devices

Original Publication

Semiconductor Engineering

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Executive Briefing & Key Highlights

Transporting the native packetized traffic of the NoC directly across die boundaries using a stable, invariant interface. The post A Network-on-Chip (NoC) For Multi-Die Devices appeared first on Semiconductor Engineering.

Topics:semiconductorchip designEDASemiconductor